Presented at the 42nd Annual Meeting of the Fuze Section, National Defense Industrial Association, San Diego, CA, April 1998.
|Barry T. Neyer||Mervat Faltas||Brad Hanna|
|John Adams||Tom Doyle||R Scott Such|
|Paul Back||Alex Strychalski|
|James Edwards||Robert Tetreault|
|EG&G Optoelectronics/Star City||EG&G Optoelectronics / Canada||NSWC Dahlgren Division|
|Miamisburg, OH 45343-0529||Vaudreuil, Quebec J7V 8P7||Dahlgren, VA 224485100|
Barry T. Neyer
1100 Vanguard Blvd
Miamisburg, OH 45342
(937) 865-5170 (Fax)
EG&G has developed a low cost hermetically sealed chip slapper detonator. The design goal for this detonator was to develop a detonator that was as cost efficient as possible and yet was extremely reliable. The detonator was also designed to survive the most severe environments. The detonator has been subjected to a wide variety of electrical, mechanical, and thermal conditioning and has performed successfully afterwards.
All of the detonator components, including the explosive, were manufactured from readily available starting materials. The HNS IV explosive, processed in EG&G facilities, meets company specifications based on the military specifications. The detonator, packaged in a TO-5 can, was designed to "plug in" to a wide variety of firing systems. The detonator has also been integrated into a multi-point initiator flexible printed circuit for evaluation by the Navy. This paper will present the detonator design and test results.
Technical Papers of Dr. Barry T. Neyer